Manufacturing company, service provider (process development, contract manufacturing, consulting, etc.), assembly, service
Development of laser processes / manufacture of laser machines
Metals (stainless steel, brass, Al, Au, Ag, Ni, W…), ceramics (Al2O3, ZrO2, PZT…), glass (B33, Nexterion, quartz glass, sapphire, high index…), polymers (stacks, PET, PI, stacks with metal layers…), semiconductors (Si, SiC), thin films (ITO, MAM…)
Cutting, drilling, structuring of glass wafers and plates made from various glass materials Laser lift-off (LLO) of glass and sapphire substrates Laser lift-off (LLO) of flexible electronic systems based on transparent glass substrates Laser processing of flexible electrical systems using roll-to-roll methods Production of microholes for fluidic applications Cutting, drilling, structuring of polymers and polymer composites for sensor technology and medical technology Laser-assisted sample preparation Separation of semiconductor wafers and solar cells using TLS dicing technology
More than ten laser systems for micromaterial processing ISO Class 7 cleanroom Solid-state lasers, gas lasers (excimer laser, CO2 laser), continuous-wave (cw) lasers, short-pulse and ultra-short-pulse lasers Wavelengths of 10600 nm, 1070 nm, 1064 nm, 532 nm, 355 nm, 248 nm High-precision axis systems, image processing, and measurement systems Various measurement systems such as confocal laser scanning microscopes, light microscopes, SEM, TEM, and tactile profilometry
System integrator, development of in-house processes, development of in-house software
ISO 9001
